Tengku Zafrul tours X-FAB Sarawak’s facilities

KUCHING (July 30): X-FAB Sarawak Sdn Bhd, a subsidiary of X-FAB Silicon Foundries SE, on Monday hosted a visit by federal Investment, Trade and Industry Minister Senator Tengku Datuk Seri Zafrul Tengku Abdul Aziz and a delegation of approximately 40 members.

X-FAB Group board of directors chairman Tan Sri Hamid Bugo was present to welcome the delegates, the company said in a press statement today.

During their visit, the minister was given a tour of the state-of-the-art facilities by X-FAB Sarawak chief executive officer Lee Boon Chun, who said the Kuching site was the largest and most modern manufacturing facility within the X-FAB group which also runs production sites in Germany, France and the United States.

This visit came at a significant time as X-FAB Sarawak was expanding its capacity.

“A new building is under construction, which will feature additional clean room space essential to meet the strong demand for X-FAB’s specialty 200mm CMOS technology, in particular its popular 180nm automotive processes.

“Every new car worldwide has on average more than 20 chips made by X-FAB inside.

“In the dynamic landscape of semiconductor manufacturing, it is with immense pride that we showcase the expansion of X-FAB Sarawak,” Lee was quoted as saying.

“The addition of a new building equipped with cutting-edge clean room facilities for our 200mm CMOS technology is a testament to our relentless pursuit of excellence,” he added.

“Hosting the honourable Minister Tengku Zafrul Aziz, along with his delegation, provides us with the unique opportunity to demonstrate our advancements and our unwavering commitment to contributing to the industry’s growth.

“We are not just constructing buildings and expanding capacity; we are building the future for X-FAB’s specialty technologies here in Kuching,” said Lee.

The progress of the construction is on schedule, with the equipment move-in planned for the fourth quarter.

X-FAB is the leading analogue/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications.
Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0µm to 110nm, and its special silicon carbide and MEMS long-lifetime processes.

X-FAB’s analogue-digital integrated circuits (mixed-signal ICs), sensors, and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the US. X-FAB employs approximately 4,500 people worldwide.